General quality guidelines
General quality guidelines We are dedicated to designing, manufacturing and marketing high quality integrated circuit products that serve our customers’ needs. Our dedicated quality organization includes customer quality representatives in each business segment, who work closely with our customers to quickly resolve quality related issues by coordinating efforts and communicating with business segments, sales and manufacturing teams. Customer quality representatives also support communication regarding, product containment, corrective action, and quality improvement programs. Our commitment to customer satisfaction is communicated through the ACPSEMI quality policy.
Anti-counterfeit
ACPSEMI is committed to delivering high-quality and reliable semiconductor solutions. To help mitigate the risk of counterfeit products, we strongly encourages its customers to purchase all ACPSEMI semiconductor products through ours authorized sources.
Many counterfeits have markings and labels that resemble those on authentic ACPSEMI products, leading customers to believe that they are genuine. Counterfeit products are not manufactured, packaged, labelled, stored or shipped according to ours standards, however, and they pose considerable performance, safety and reliability risks.
Product change notification (PCN)
After a product released to market, we may need to modify, update or discontinue the product or manufacturing process. Customer will be notified of major changes which affect the form, fit or function, or adversely affect quality or reliability of the product.
Semiconductor product withdrawal/discontinuance (obsolescence)
ACPSEMI’s product withdrawal/discontinuance process complies with J-STD-048. Our company makes an effort to not obsolete products out of convenience. In addition, our standard obsolescence withdrawal schedule provides a longer lead time than the industry standard. Our schedule allows 6 months for the last order and an additional six months to take final delivery of obsolete products. In rare circumstances, an accelerated withdrawal schedule may be necessary. In such cases, we will communicate to affected customers the last time buy and final delivery dates
Failure analysis
Failure analysis (FA) entails vast analytical methods and techniques to understand issues that may occur in the manufacturing or application of our products. Our FA engineers or analysts are equipped to address the complex process, as they are proficient in design, process, assembly and test, and applications, with deep knowledge of physics, electrical, chemical and mechanical engineering.
Failure analysis process
ACPSEMI’s FA process discovers electrical and physical evidence to clearly identify the cause of failure through straightforward but sophisticated analytical measurement systems, bench top equipment, and a range of other techniques. Using appropriate equipment and work processes, the location of the failure cause is determined, isolated on the die, and physically characterized. The FA team then collaborates with other engineering disciplines (product, test, design, assembly and process) to move analysis forward. Progress, results and conclusions are communicated to internal and external contacts supporting the processes, to implement changes that limit and/or eliminate the cause of failure.
